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SAN FRANCISCO, May 4 (Xinhua) -- Intel Corp. on Wednesday announced that it will mass-manufacture chips using new transistors featuring a three-dimensional (3-D) structure, calling it a technical breakthrough in microprocessors. The 3-D transistor, c

发表于:2019-02-05 / 阅读(217) / 评论(0) 分类 英语新闻
学英语单词
'mong
.udf
a lead
a'la
accounting income
AHVC
air report
alloiometric
ambig class
asks me out
attitude passionnelle
Avahi laniger
bale space
body forming
brandwein
cafe noirs
cement water-ratio
chief stevedore
Clancy process (for gold extraction)
classification of evidence
concordly
container ships
conveying tube
coronaria ventriculi
crawling traction
creatininases
current phase
cut splice
decubitus ulcer
drunk as a bilod owl
dynamic hardware reconfiguration
elimination of tautologies
eomesodermin
Everitt
expansion chuck
fajr
flood irrigation
forum contractus
frame section surface
freelon
frogfarm
Gaigeria
glossoplegia
glued-laminated timber rigid frame
gun spraying
heterogenesis
hoker
Jaggarnat
kalium hydroxyquinolinum sulfuricum
keep the peace
laser ablation
lgth
line outage
liquid helium cooling
lo weite
logging recorder
loss of penis
m. genioglossus
mabolos
machine loads
mechanics of stick-slip
mercury-containing sludge
micromuses
mid-side node
moist timber
nail removal
orthomutation
oscillant
passing up
pick up piston
planesman
power control circuit
power sander
pressure transmitting medium
Prunus spinosa L.
Putabenge
Pyrrhonically
ramped floor
rechosen
retentio basin
right to claim damages
rowdydow
Samia walkeri
schoolboy error
Seti I
shipment schedule
silicide ceramics
Silicoflagellata
single function instrument
small-to-midsize business
special repair truck
St. Mark
static breakpoint
switching knob
Thiele's syndrome
tie-dyer
tishman
toranzo
tromboon
tytonidaes
UNIDCP
working torsion angle