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SAN FRANCISCO, May 4 (Xinhua) -- Intel Corp. on Wednesday announced that it will mass-manufacture chips using new transistors featuring a three-dimensional (3-D) structure, calling it a technical breakthrough in microprocessors. The 3-D transistor, c

发表于:2019-02-05 / 阅读(360) / 评论(0) 分类 英语新闻
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acrylic latex coating
ammonia sulfate
angelesbased
azymites
babal
be on the run
belt bucket-elevator
bodyfit
Callavia
cathode block
cave flag
chaffcutter
Chalmettian
client software
coke-packed tower
colour bar generator pattern
Columbus Bk.
combination rolling mill practice
cup-shaped armature
drevitz
drinking water tank
duplicate bridge
earnings before interest and tax
endotoxine
epileptic state
estemmenosuchids
export list
flat bed offset printing machine
fructuaries
full stop landing (fsl)
gas-fired crucible furnace
graunchy
harm-to-others
Hato, R.
imposing table
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Japan Industrial Standard
light maintenance and installation truck
Macchiavello's staining method
majority vote
manufacturing of scientific instruments
maunde
Mayuka
meales immune globulin
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oil-bearing formation
one on, one off
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overslip
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petty loan
phrenicohepatic fossae
plating of culture
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premake
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recurring unit
recusations
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seawater comprehensive utilization
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staging cost
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theory of algebraic curves
ticking me off
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tool-to-tool
tremolitization
trump up a charge
ukics
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unique factorization domain
vertical multitubular boiler
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